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Syagrus Systems is a leading provider in post fab processes like wafer backgrinding & dicing, die inspection & sorting, & SMD Tape & Reel for many industries. Contact us today for more information! A variety of services are provided to meet your needs. All services are designed to be "consistently flexible", in that we can easily modify our processes and react quickly to your needs, while...
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I was looking for a high quality scribing/breaking machine to cleave quantum cascade laser wafers into laser chips. I had a limited budget. The Dynatex team closely worked with me to fully understand the technical requirements for my laser fabrication processes. At the end, they offered me a refurbished system configuration within my budget that fully met my technical requirement. The system...
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GDSI , Grinding and Dicing Services complete resource for Silicon Wafers Processing includes Probing, Bumping, Grinding, Polishing in San Jose, California. Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the...
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We provide quick turn precision laser dicing of various materials. Customers include telecommunications, biotech, medical, the semiconductor industry and many others. The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic...
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MPE, Inc. is committed to outstanding customer service and your satisfaction is our #1 priority. We pride ourselves on our ability to complete all jobs in a timely and efficient manner. We process hundreds of wafers per month, with a normal lead time of three to five days. In most cases, we do...
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Using the highest quality materials, Dicing Blade Technology manufactures and sells a complete line of resinoid, nickel, and metal sintered dicing blades for a range of applications. Any size, thickness, and grit size. Dicing Blade Technology can custom manufacture a solution for you. Have an idea of what you need? Get the answers you need using our easy to use form.
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Loadpoint develop and manufacture high precision dicing saws and machining systems for Semiconductors, MEMs, PZT and Piezo materials, Photonics and related industries. Loadpoint also supply dicing blades and dicing tapes and a range of other dicing consumables. Loadpoint works with their customers to help them overcome their dicing challenges so that they can develop new products and better...
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SlicingTech provides wire saw contract cutting, both slurry and diamond wire as well as ID and OD slicing. Our Wire Saws provide for slicing diameters up to 385 mm. Large table loading capabilities enable us to slice thousands of parts in as little as a three hour cycle time. This provides our customers with lowest possible price per piece. Our Wire Saws and ID Saws provide for low kerf loss...
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Wafer processing services including wafer grinding and thinning, wafer reclaim, wafer edge trimming, wafer dicing, wafer resizing, wafer polishing and wafer bonding. OPTIM Wafer Services offers individually tailored solutions for each customer's requirements in wafer surface processing, cleaning and handling substrates. We have been providing wafer processing services offering a local, high...
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The ingot is them sliced using a wire saw or an inside diameter saw to create a wafer that is uniform in thickness. The lapping and polishing processes are done to achieve the right thickness and to eliminate any imperfections that may be present in the rough wafer. The wafers can be single side or double side polished. The polished side of the wafer is the side that will be used to make the...
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WaferNet is a top silicon wafer supplier to the semiconductor industry serving semiconductor equipment manufacturers around the globe, universities of all sizes, and many research and development companies. We are the Semiconductor Materials Network and are ready to serve your needs from our extensive inventory or from our well developed network of silicon wafer manufacturers and silicon wafer...
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ITI is a world leading manufacturer of superabrasive products focused on Precision Dicing Blades and Fine-Grinding (Flat-Honing) Plates. Our products are used globally on an infinite variety of applications including semiconductor packaging, glass, ceramics, crystals, composites, silicon carbide, hard disk drives, compound semiconductors, Chip-LED, HP LED (High Power LED), quartz, and also a...
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Sierra Components, Inc. (SCI) is proud to announce we are now a franchised distributor for all bare die and wafer products offered by Central Semiconductor Corp. Central Semi’s mission has always been to be a growing, profitable organization offering reliable, world-class products and outstanding service. SCI and Central Semiconductor share the same primary goal which is to exceed customers’...
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Glass wafer dicing service, substrates dicing service, production CNC dicing service and other dicing services provided by Production Dicing. Utilizing programmable DISCO and K&S saws, parts can be diced to micron level tolerances with 200X optical magnification. Valley has recently expanded its dicing department, and now offers one of the largest production dicing capacities in the industry....
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We supply semiconductor wafer, custom dicing hybrid, substrate dicing and all types of dicing at customdicing.com. Get a dicing quotation. Accurate dicing services for customer materials up to 6" in diameter or square and rectangles as large as 6"x14". Materials processed are as diverse as Fused Silica, Silicon wafers, Glass, Sapphire and Quartz disks, Silicon Carbide, Ferrites, Ceramics, MEMS...
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PDP Micro Dicing Services provides dicing and sawing services to the microelectronic and optical industry. We specialize in hard to cut and brittle materials. PDP Micro Dicing Services has an in house production and research facility. Be sure to contact us for all of your dicing and sawing needs. Micro Dicing Services provides Sawing Services to the microelectronic and the optical industry. Our...
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We are a team of an experienced energetic entrepreneurs that started INTECH back in year 2008. We embark in our semiconductors adventure believing in innovation, integration and interdependent-focused solutions in post fabrication and semiconductors packaging services. Focusing on our customers’ requirements and the significance of time-to-market, we want to help our customers stay competitive...
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We provide polishing, lapping, and dicing services for optical components, glass wafers, optical substrates, etc. Try our optical polishing services. Valley Design is an ISO 9001:2015 certified manufacturer, and is committed to customer satisfaction and to continually improving our products, services and the internal procedures which make our business run. For over 37 years, Valley Design has...
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GTS started as a service company repairing and providing preventive maintenance on Disco dicing saws and K&S dicing saws. GTS now offers the industry the highest quality, best supported refurbished tools and products second to none. GTS started as a service company repairing and providing preventive maintenance on Disco dicing saws and K&S dicing saws. Upon seeing what customers were purchasing...
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Advanced International Technology of San Diego provides precision wafer processing, wire bonding, micro assembly & fabrication services. Rapid Turnaround Solutions for Dicing and Micro Assembly Services Advanced International Technology specializes in high-quality wafer processing and dicing, micro assembly and fabrication services, providing clients with the highest degree of precision...
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