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Provides quick turn precision wafer dicing of hard brittle materials. Customers include telecommunications, biotech, medical, optical, the semiconductor industry, and many others. To see what we can do for you. Email or phone 408 254-1600. American Precision Dicing, Inc. - Quick turn wafer dicing.
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1
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ThermocarbonÂ’s continuous research and development on hubless blade compositions allows Thermocarbon to consistently produce high quality saw blades for cutting ceramics such as alumina oxide, alumina nitride, LTCC, HTCC; crystals such as sapphire, lithium niobate, lithium tantalate; other hard and brittle materials such as glass, fused silica, quartz, silicon wafers, garnet, copper, mold...
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2
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Production facility for semiconductor and microelectronics industry. Services include wafer dicing, die sorting, die bonding and wirebonding. Since 1987, American Dicing Inc. has been a high precision dicing and scribing operation for the microelectronic and miniature fabrication industries. We...
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3
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GDSI , Grinding and Dicing Services complete resource for Silicon Wafers Processing includes Probing, Bumping, Grinding, Polishing in San Jose, California. Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the...
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4
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For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical. See what it's like to be an ESI customer...
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5
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High volume production dicing of wafers and substrates with quick turnaround utilizing precision dicing equipment from DISCO and K & S, from R & D prototypes to full production. Utilizing programmable DISCO and K&S saws, parts can be diced to micron level tolerances with 200X optical magnification. Valley has recently expanded its dicing department, and now offers one of the largest production...
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6
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The best process naturally starts with the best equipment. Our MTI saws are built for stiffness and rigidity. They have long been the work horse of the disk drive industry. They feature precision stages and controllers, air bearing spindles, CNC programming, and machine vision (pattern recognition & edge detection). More than 30 year combined experience in dicing process engineering. We have...
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7
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Syagrus Systems is a leading provider in post fab processes like wafer backgrinding & dicing, die inspection & sorting, & SMD Tape & Reel for many industries. Contact us today for more information! A variety of services are provided to meet your needs. All services are designed to be "consistently flexible", in that we can easily modify our processes and react quickly to your needs, while...
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8
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We provide quick turn precision laser dicing of various materials. Customers include telecommunications, biotech, medical, the semiconductor industry and many others. The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under...
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9
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I was looking for a high quality scribing/breaking machine to cleave quantum cascade laser wafers into laser chips. I had a limited budget. The Dynatex team closely worked with me to fully understand the technical requirements for my laser fabrication processes. At the end, they offered me a refurbished system configuration within my budget that fully met my technical requirement. The system...
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10
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Spectrum Micromechanical is a technical services business located in coastal San Diego near the University of California. We are involved in product and process development for R&D groups in industry or academia needing to outsource these services. Typically our customers have thin-film devices they need integrated into their product or process. Or sometimes they need a service performed such...
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11
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Wafer dicing, optical and fiber optic materials dicing, MEMS dicing and hybrid and semiconductor circuits dicing as well as wafer backgrinding. Accurate dicing services for customer materials up to 6" in diameter or square and rectangles as large as 6"x14". Materials processed are as diverse as Fused Silica, Silicon wafers, Glass, Sapphire and Quartz disks, Silicon Carbide, Ferrites, Ceramics,...
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12
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Can handle wafers up to 200 mm in its class 100 clean room. If you don't have a complete wafer, no problem. Sawstreet receives substrates or wafers in many forms including complete wafers, broken or cracked wafers, or reticles. We have a broad range of experience with Silicon, GaAs, GaN, SiGe, InP, ceramic, and glass just to name a few and we handle thicknesses as low as .002" or 50 microns....
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13
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PDP Micro Dicing Services provides dicing and sawing services to the microelectronic and optical industry. We specialize in hard to cut and brittle materials. PDP Micro Dicing Services has an in house production and research facility. Be sure to contact us for all of your dicing and sawing needs. Micro Dicing Services provides Sawing Services to the microelectronic and the optical industry. Our...
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14
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We are a team of an experienced energetic entrepreneurs that started INTECH back in year 2008. We embark in our semiconductors adventure believing in innovation, integration and interdependent-focused solutions in post fabrication and semiconductors packaging services. Focusing on our customers’ requirements and the significance of time-to-market, we want to help our customers stay competitive...
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15
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Loadpoint develop and manufacture high precision dicing saws and machining systems for Semiconductors, MEMs, PZT and Piezo materials, Photonics and related industries. Loadpoint also supply dicing blades and dicing tapes and a range of other dicing consumables. Loadpoint works with their customers to help them overcome their dicing challenges so that they can develop new products and better...
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16
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GTS started as a service company repairing and providing preventive maintenance on Disco dicing saws and K&S dicing saws. GTS now offers the industry the highest quality, best supported refurbished tools and products second to none. GTS started as a service company repairing and providing preventive maintenance on Disco dicing saws and K&S dicing saws. Upon seeing what customers were purchasing...
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17
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Polishing, lapping, back-lapping, dicing, backgrinding are some of the capabilities of the world's leading company supplying optical polishing services. Valley Design is an ISO 9001:2015 certified manufacturer, and is committed to customer satisfaction and to continually improving our products, services and the internal procedures which make our business run. For over 37 years, Valley Design...
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18
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AIT provides thin film fabrication services: deposition, sputtering, photolithography, etching / lift off. Back end wafer processing: dicing, wire bonding, ion milling, micro-machining & assembly. Biotechnology in Mems and Nanotechnology applications. Applications in Data Storage, Biotechnology, MEMS and Nanotechnology Our engineers and technicians are experts in their field and work with you...
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19
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Wafer Reclaim and processing services including wafer grinding and thinning, wafer edge trimming, wafer dicing, wafer resizing, wafer polishing and wafer bonding from Rockwood Wafer Reclaim. We have been providing wafer processing services offering a local, high quality, reliable, value for money service to our customers for over thirty years. As well as providing unrivalled technical support....
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20
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