Sort
Basically, pull your socks up and install a modern browser, NOW! This is not just for this site but because you are missing much of the web's enjoyment and expose your computer to many security issues. Get a new one, FireFox, Opera, Nescape, Mozilla, Explorer, no excuses, they are free. If you can read this message, your browser does not fully support CSS standards. 99% of the site layout is...
Rank
1
Vote
Sponsor
0.0
TLMI Corp is a Full Service Wafer Bumping and Pad Redistribution company. Offering a wide range of copper, indium , gold, and solder bumping services. When you are looking for Quality and dependability, rely on TLMI as your full-service wafer bumping partner. TLMI, strategically located in Austin, TX, is dedicated to delivering the highest customer satisfaction and most advanced technology in...
Rank
2
Vote
Sponsor
0.0
I2a Technologies provides wafer packaging services. From dicing and wirebonding, to wafer level packaging ie, ubm, bumping flip chip, bga, etc. I2a Technologies makes no guarantee or warranty of its accuracy, or that the use of such information will not infringe upon the IP rights of third...
Rank
3
Vote
Sponsor
0.0
Serving both high volume and niche markets, and everything in between, IC Interconnect is adept at providing the solutions that fulfill you and your customer’s needs. ISO 9001: 2008 Certified. From standard products to boundary pushing R&D projects, ICI is always open to new opportunities for...
Rank
4
Vote
Sponsor
0.0
The official website of PacTech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services. PacTech is a leading supplier of Advanced Packaging Equipment with more than eighteen years of engineering experience. Our state-of-the-art automated...
Rank
5
Vote
Sponsor
0.0
Wafer world offers quality silicon wafers to companies, laboratories and educational institutions,customized to meet their project’s exact. Founded in 1997 by CEO & President Sean Quinn, Wafer World Inc. has since been satisfying customers across six continents in over 45 countries. Wafer World, Inc. serves as a privately held company located in West Palm Beach, FL. The 12,000 sq. ft facility...
Rank
6
Vote
Sponsor
0.0
Designed and developed by Codify Design Studio - codifydesign.com. Wafer bumping is a fast-growing method of packaging silicon for high-density and high-frequency applications. The bumping process is constantly being improved and cost is decreasing, making these interconnect methods more popular. To enable this technology, semiconductor-inspection systems are now incorporating sophisticated...
Rank
7
Vote
Sponsor
0.0
FlipChip International is a world leading WLCSP bumping supplier, with wafer dicing and thinning capabilities, ASIC, ASPP and ASSP design, and a complete IC service from design to packaging. FlipChip International, LLC (FCI) is the world’s premier technology and merchant supplier of advanced Wafer Level Packaging solutions. FCI offers a wide range of leading edge technologies and services for...
Rank
8
Vote
Sponsor
0.0
A prime supplier of conduction+convection SMT reflow soldering ovens and systems to some of the major high technology companies in the USA, Asia and Europe. Reflow Profiling for New Users We are often asked the question “How do I develop a temperature profile” for my Sikama oven. Conduction heat and dwell, two unique features that set Sikama ovens apart from the competition seem very foreign to...
Rank
9
Vote
Sponsor
0.0
Founded in 1971, IMI is a provider of wafer bumping and wafer level processing (WLP) contract services to EMS customers and end-users in the advanced packaging, MEMS and advanced sensor markets. IMI provides scalable wafer bumping and wafer level processing services from prototyping of new designs through high-volume sustained production and turn-key technology licensing agreements for our...
Rank
10
Vote
Sponsor
0.0