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We provide quick turn precision laser dicing of various materials. Customers include telecommunications, biotech, medical, the semiconductor industry and many others. The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under...
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1
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We are experienced laser drilling, laser cutting, laser micromachining products supplier and factory in China, we can offer you customized high quality laser drilling, laser cutting, laser micromachining. If you are interested in our laser drilling, laser cutting, laser micromachining products, please contact us right now! After long time testing and demonstration, the ERP system finally has...
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2
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Inventor of the Laser MicroJet technology, Synova is the unique supplier of water jet-guided laser cutting systems for a broad range of micro-machining applications. Laser MicroJet enables new material processing capabilities and lower manufacturing costs per unit. “We would like to acknowledge...
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3
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Wafer dicing, optical and fiber optic materials dicing, MEMS dicing and hybrid and semiconductor circuits dicing as well as wafer backgrinding. Accurate dicing services for customer materials up to 6" in diameter or square and rectangles as large as 6"x14". Materials processed are as diverse as...
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4
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Customers can call on DISCO’s precision tools and precision equipment by using the chargeable processing service DGS (Dicing-Grinding Service). DISCO EUROPE is proud to introduce its new laser laboratory. The lab features 4 short pulse lasers, 1 research-grade dicing machine, and a set-up for...
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5
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Production facility for semiconductor and microelectronics industry. Services include wafer dicing, die sorting, die bonding and wirebonding. Since 1987, American Dicing Inc. has been a high precision dicing and scribing operation for the microelectronic and miniature fabrication industries. We offer a broad range of services covering prototypes to production volumes and we can handle up to 12"...
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6
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GDSI , Grinding and Dicing Services complete resource for Silicon Wafers Processing includes Probing, Bumping, Grinding, Polishing in San Jose, California. Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the desired results for your specific project, GDSI continuously researches emerging applications...
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7
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Syagrus Systems is a leading provider in post fab processes like wafer backgrinding & dicing, die inspection & sorting, & SMD Tape & Reel for many industries. Contact us today for more information! A variety of services are provided to meet your needs. All services are designed to be "consistently flexible", in that we can easily modify our processes and react quickly to your needs, while...
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8
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Pelican Packaging is recognized as a leading providers of full service automated semiconductor packaging. We provide a one stop service for all your packaging needs. Our services include but are not limited to: Tape and Reel, Laser Marking, Wafer Dicing, Electrical Test, Bowl Feeders, Odd Shapes, etc. Pelican Packaging uses state of the art automated packaging machines and equipment powered by...
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9
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For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical. See what it's like to be an ESI customer - contact an ESI Sales Expert today. Wafer processing solutions that enable you to maintain...
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10
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GTS started as a service company repairing and providing preventive maintenance on Disco dicing saws and K&S dicing saws. GTS now offers the industry the highest quality, best supported refurbished tools and products second to none. GTS started as a service company repairing and providing preventive maintenance on Disco dicing saws and K&S dicing saws. Upon seeing what customers were purchasing...
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11
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Wir entwickeln aus Innovationen der Lasertechnologie hocheffiziente Maschinenlösungen für die industrielle Produktion. In unserem Applikationslabor übernehmen Spezialisten die kundenspezifische Prozessentwicklung. Hier werden laserbasierte Bearbeitungsverfahren den Herausforderungen moderner Produktionsbedingungen angepasst. Durch das modulare Plattformkonzept kann jedes unserer Lasersysteme...
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12
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The ingot is them sliced using a wire saw or an inside diameter saw to create a wafer that is uniform in thickness. The lapping and polishing processes are done to achieve the right thickness and to eliminate any imperfections that may be present in the rough wafer. The wafers can be single side or double side polished. The polished side of the wafer is the side that will be used to make the...
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13
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We provide researches and develop advanced technologies of laser precise processing of materials. The unique technology of treatment the extra-firm transparent materials (quartz, glass, sapphire) "IntraScribe" is specially aimed at high-bright LED industry. Our production facilities include set of flexible tuned technological setups for laser precise treatment (cutting, marking, trepanning,...
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14
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3D-Micromac AG is the industry leader in laser micromachining. We develop processes, machines and turnkey solutions at the highest technical and technological level. Our aim is to provide superb customer satisfaction even for the most complex projects. 3D-Micromac delivers powerful, user-friendly and leading edge processes with superior production efficiency. These proprietary technology...
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15
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We at Applied Laser Solutions combine over 50 years in the laser cutting and motion control industries to bring you the exacting solutions you require. We provide custom laser CNC machines, advanced laser cutting applications, and engineering expertise to solve your technological issues. We handle all types of laser cutting in many different materials which lend themselves well to laser...
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16
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I was looking for a high quality scribing/breaking machine to cleave quantum cascade laser wafers into laser chips. I had a limited budget. The Dynatex team closely worked with me to fully understand the technical requirements for my laser fabrication processes. At the end, they offered me a refurbished system configuration within my budget that fully met my technical requirement. The system...
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17
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