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Our market focus includes: Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP. For more information, please contact our professional team of experienced engineers worldwide here. AMICRA Microtechnologies is a worldwide leading supplier of ultra high precision Die Attach Equipment specializing in submicron placement accuracy (±0.5µm@3s). Our equipment...
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Dr. Tresky, Innovation, Die Bonder, Bestückungsgeräte, seit 1980, Industriebranchen, Microelektronik, Optoelektronik. The T-6000L Die Bonder is a fully-automated all-purpose system for R&D, pilot and medium size production. A force range of 20g to 800g (optional 10g to 5kg), combined with the large working area of 400 x 315mm. And wafer handling up to 8”, open a wide range of applications. With...
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Leading automated component packaging systems and premier contract assembly solutions - high-accuracy wire bond and die attach systems. In wire bonding, a gold ball is forced down and thermosonically bonded to a die-bond pad forming the first connection of an integrated circuit (IC) and...
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Specialized systems are required to assemble these types of packages. Thin Silicon, GaAs and Gallium Nitride devices require delicate, well-controlled, contact force while being picked from wafer, waffle pack or Gel-Pak and being placed onto substrates and packages. MRSI offers pulse-heating,...
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Mech-El will be able to factory refurbish your MEI bonder in our "Good as new" program. We can also refurbish logic cards, power supplies, dampers, etc. Mech-El will continue to produce the 700, 800, 900 and 1200 series of bonders. Mech-el bonders will come with the MEI Manufacturers warranty....
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CMTec is a Trading & Consulting Company with strong technical support focusing on the Semiconductor assembly market. We are your one stop shop for Machines: “as is” or fully refurbished to OEM specification. CMTec is highly specialized in dealing with assembly equipment. We support BESI (ESEC, Datacon), Kulicke & Soffa, Hesse & Knipps, F&K Delvotec, Orthodyne, ASM, Dage and others. CMTec...
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Die-Bond's specialized approach for manufacturing conformal cooling passages makes injection modling dies run faster while minimizing costs. Die-Bond’s Specialized Approach for Manufacturing Conformal Cooling Passages Makes Injection Molding Dies Run Faster While Minimizing Costs Using a Liquid Interface Diffusion (LID) bonding process, Die-Bond joins split-layer injection molding dies...
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Questar produces high quality automatic wire bonders, workholders, and automatic wire bonding machines designed for low maintenance and quick changeover. Where productivity meets affordability Questar fine pitch automatic wire bonders solve the day-to-day challenges associated with. By most bonder manufacturers, why pay for it? Find out how Questar can help you meet your automatic wire bonding....
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Boston Micro-Components is your source for thin film circuit fabrication, wire bonders and semiconductor sales in New England. Our electronic component products include thin film circuit fabrication, microwave diodes and transistors, cavity, ceramic, chip and wire filters. We also sell a complete line of thin film RF components, inductors and pre-applied adhesives for package lids. Boston...
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Micronnect liefert Ihnen und berät Sie für viele Bondprodukte in ganz Europa. Micronnect gives courses and machine instructions in Europe. Course material is in English; spoken language can be: Dutch, English, French and German. Courses can be adapted to user specific wishes. Ask for more information or for a quotation. Micronnect b.v. Micronnect b.v. Your supplier for wire bonding, die...
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J Brajkovich Die Attach Specialties is your expert die bonding and die attach solution for your maintenance, applications, and consulting needs. J Brajkovich Die Attach Specialties for your die attach needs. Is currently under construction. We'll be back soon.
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High accuracy, modular die bonders for flip chip, assembly, packaging, and die attach. Advanced rework stations for BGAs, small passives, QFNs, package on package, and reballing. The Lambda die bonder is the ideal choice for prototyping, R&D and low volume production environments where flexibility is the key. Used for high accuracy die attach and component placement, this cost-effective bonder...
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BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, computer, automotive, industrial, LED and solar energy. BE Semiconductor Industries to Host Advanced Packaging Technology Symposium at... BE Semiconductor Industries Announces...
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Was established in 2000. Over the years, we have expanded our products and services to Semiconductor Industry. Our main products is on Semiconductor Spare Parts. Industrial Quality Control Software, Automated InspectionSolution, Used Semiconductor for Equipments and Surplus Instruments / Parts. We also provide sourcing service to serve our partner better. Since it inceptions, we never stop...
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