Sort
High accuracy, modular die bonders for flip chip, assembly, packaging, and die attach. Advanced rework stations for BGAs, small passives, QFNs, package on package, and reballing. Finetech rework systems for R&D and production environments are capable of reworking smallest LED devices. A typical use case is reworking LED triplets (RGB) on modern displays. The Finetech rework cycle includes all...
Rank
1
Vote
Sponsor
0.0
Supplier/Manufacturer of Flip Chip bonders, Die bonders, BGA / QFN / SMT rework stations, soldering equipment, smt rework and pick and place machines. Wir haben unser Webangebot für Sie erweitert. Ab sofort können unsere Französisch sprechenden Kunden die gesamte Finetech Micro Assembly Sparte in ihrer Muttersprache kennenlernen.... Vom 10-11. Oktober 2017 hat Finetech an der Germany@CERN...
Rank
2
Vote
Sponsor
0.0
Welcome to the new & improved K&S corporate website, redesigned with usability in mind to bring you a new level of user experience, and an easier way to browse content. K&S will be showcasing its complete line of solutions that enables a smart future, from January 31 to February 2, at the COEX,...
Rank
3
Vote
Sponsor
0.0
CMTec is a Trading & Consulting Company with strong technical support focusing on the Semiconductor assembly market. We are your one stop shop for Machines: “as is” or fully refurbished to OEM specification. CMTec is highly specialized in dealing with assembly equipment. We support BESI (ESEC,...
Rank
4
Vote
Sponsor
0.0
For flip chip bonding, chip-to-chip bonding, chip-to-wafer and direct metallic bonding, SET offers flexible flip chip bonders and die bonders that can align and bond components with submicron post-bond accuracy. Flip Chip and Chip to Chip bonding, Die Bonders, Direct Metallic Bonding: SET...
Rank
5
Vote
Sponsor
0.0
The Ontos7 is our atmospheric plasma system designed for and dedicated exclusively to the semiconductor manufacturing and packaging industry. Our patented (and patent pending) equipment and processes provide a unique advantage to our customers to enable low-cost, high yield, high-speed, chip-to-chip interconnect bonds at room temperature with minimal force. Ontos Atmospheric Plasma also...
Rank
6
Vote
Sponsor
0.0
Mech-El will be able to factory refurbish your MEI bonder in our "Good as new" program. We can also refurbish logic cards, power supplies, dampers, etc. Mech-El will continue to produce the 700, 800, 900 and 1200 series of bonders. Mech-el bonders will come with the MEI Manufacturers warranty. Factory authorized service center. We provide prompt service and support. We will also provide parts...
Rank
7
Vote
Sponsor
0.0
Die-Bond's specialized approach for manufacturing conformal cooling passages makes injection modling dies run faster while minimizing costs. Die-Bond’s Specialized Approach for Manufacturing Conformal Cooling Passages Makes Injection Molding Dies Run Faster While Minimizing Costs Using a Liquid Interface Diffusion (LID) bonding process, Die-Bond joins split-layer injection molding dies...
Rank
8
Vote
Sponsor
0.0
It's the most versatile semi automatic Pick & Place platform. It can be used in a wide field of applications such as ASIC, MMIC, MEMS or VECEL. The machine will pick the components from wafer hoops to place them into GelPack or Waffle Packs. + information. Our die bonders achieve high accuracy placement, using adjustable magnification optical device. High performance, accurate, flexible,...
Rank
9
Vote
Sponsor
0.0
Questar produces high quality automatic wire bonders, workholders, and automatic wire bonding machines designed for low maintenance and quick changeover. Where productivity meets affordability Questar fine pitch automatic wire bonders solve the day-to-day challenges associated with. By most bonder manufacturers, why pay for it? Find out how Questar can help you meet your automatic wire bonding....
Rank
10
Vote
Sponsor
0.0
Sales, service and repair of manual and semiautomatic wire bonders, semiconductor process and assembly equipment. Manual Bonders are our specialty We specialize in the sales and service of manual wire bonders and have an extensive inventory of used equipment including Kulicke & Soffa (K&S), Hybond, Orthodyne, Mech-El, WestBond and Unitek. See our Equipment List. In addition to the service and...
Rank
11
Vote
Sponsor
0.0
Boston Micro-Components is your source for thin film circuit fabrication, wire bonders and semiconductor sales in New England. Our electronic component products include thin film circuit fabrication, microwave diodes and transistors, cavity, ceramic, chip and wire filters. We also sell a complete line of thin film RF components, inductors and pre-applied adhesives for package lids. Boston...
Rank
12
Vote
Sponsor
0.0
Our market focus includes: Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP. For more information, please contact our professional team of experienced engineers worldwide here. AMICRA Microtechnologies is a worldwide leading supplier of ultra high precision Die Attach Equipment specializing in submicron placement accuracy (±0.3µm@3s). Our equipment...
Rank
13
Vote
Sponsor
0.0
BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, computer, automotive, industrial, LED and solar energy. BE Semiconductor Industries Announces Transactions Under Share Repurchase... Besi Shares To Be Included in STOXX Europe 600...
Rank
14
Vote
Sponsor
0.0
J Brajkovich Die Attach Specialties is your expert die bonding and die attach solution for your maintenance, applications, and consulting needs. J Brajkovich Die Attach Specialties for your die attach needs. Is currently under construction. We'll be back soon.
Rank
15
Vote
Sponsor
0.0
Module is a beam splitter optics, which allows the simultaneous viewing of two objects by an optical overlay (superposition) on the monitor. The Flip-Chip optics has a built-in Ultra HD camera with digital magnification as well as integrated LED lights for optimal illumination of various substrates and components. In combination with the high magnification and the XYTable micro positioning...
Rank
16
Vote
Sponsor
0.0
Micronnect liefert Ihnen und berät Sie für viele Bondprodukte in ganz Europa. Micronnect gives courses and machine instructions in Europe. Course material is in English; spoken language can be: Dutch, English, French and German. Courses can be adapted to user specific wishes. Ask for more information or for a quotation. Micronnect b.v. Micronnect b.v. Your supplier for wire bonding, die...
Rank
17
Vote
Sponsor
0.0