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Production facility for semiconductor and microelectronics industry. Services include wafer dicing, die sorting, die bonding and wirebonding. Since 1987, American Dicing Inc. has been a high precision dicing and scribing operation for the microelectronic and miniature fabrication industries. We offer a broad range of services covering prototypes to production volumes and we can handle up to 12"...
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1
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Using the highest quality materials, Dicing Blade Technology manufactures and sells a complete line of resinoid, nickel, and metal sintered dicing blades for a range of applications. Any size, thickness, and grit size. Dicing Blade Technology can custom manufacture a solution for you. Have an idea of what you need? Get the answers you need using our easy to use form.
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2
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Thermocarbon’s continuous research and development on hubless blade compositions allows Thermocarbon to consistently produce high quality saw blades for cutting ceramics such as alumina oxide, alumina nitride, LTCC, HTCC; crystals such as sapphire, lithium niobate, lithium tantalate; other hard...
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3
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Glass wafer dicing service, substrates dicing service, production CNC dicing service and other dicing services provided by Production Dicing. Utilizing programmable DISCO and K&S saws, parts can be diced to micron level tolerances with 200X optical magnification. Valley has recently expanded its...
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4
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GDSI , Grinding and Dicing Services complete resource for Silicon Wafers Processing includes Probing, Bumping, Grinding, Polishing in San Jose, California. Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the...
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5
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ITI is a world leading manufacturer of superabrasive products focused on Precision Dicing Blades and Fine-Grinding (Flat-Honing) Plates. Our products are used globally on an infinite variety of applications including semiconductor packaging, glass, ceramics, crystals, composites, silicon carbide, hard disk drives, compound semiconductors, Chip-LED, HP LED (High Power LED), quartz, and also a...
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6
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Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website provides overall corporate information of DISCO such as the variety of products and technical information on the semiconductor manufacturing equipment, investor relations, and recruiting. Preliminary Report on Consolidated Sales Figures and Non-Consolidated Earnings...
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7
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Dicing On The Cake - Games Cafe. Board Games, Card Games, Dice, Miniatures, TCG, CCG, LCG, Gaming Hobbyist. You can help us make this a reality! We have a wide range of games and accessories available to buy right now on-line and every purchase helps bring us closer to our goal. We stock all your favourite games as well as the newest releases. If we don’t have the game you really want we’ll...
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8
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The ingot is them sliced using a wire saw or an inside diameter saw to create a wafer that is uniform in thickness. The lapping and polishing processes are done to achieve the right thickness and to eliminate any imperfections that may be present in the rough wafer. The wafers can be single side or double side polished. The polished side of the wafer is the side that will be used to make the...
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9
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I was looking for a high quality scribing/breaking machine to cleave quantum cascade laser wafers into laser chips. I had a limited budget. The Dynatex team closely worked with me to fully understand the technical requirements for my laser fabrication processes. At the end, they offered me a refurbished system configuration within my budget that fully met my technical requirement. The system...
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10
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Syagrus Systems is a leading provider in post fab processes like wafer backgrinding & dicing, die inspection & sorting, & SMD Tape & Reel for many industries. Contact us today for more information! A variety of services are provided to meet your needs. All services are designed to be "consistently flexible", in that we can easily modify our processes and react quickly to your needs while...
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11
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AE Advanced Engineering is a world leader in providing Dicing Environment equipment and materials to the semiconductor industry. Known for its reliable and robust products, AE develops innovative and marker-driven systems for use in the sophisticated and highly demanding microelectronics assembly market. Constantly working with its customers to help them meet ever-evolving process requirements,...
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12
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0.0
Conformal Coatings Dicing and Grinding Tapes & Greases Die-Attach Paste and Film Adhesives Thermal Adhesives and Interface Materials (TIM) Insulated Metal Substrate and Metal Core Printed Substrates AIT Brochure Of Insulated Metal Thermal Substrate (IMTS) EMI/RFI Shielding Lid Sealing Flip-Chip and Specialty Adhesive Materials Underfill Compounds Substrate & Component Attach Paste and Film...
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13
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GTS started as a service company repairing and providing preventive maintenance on Disco dicing saws and K&S dicing saws. GTS now offers the industry the highest quality, best supported refurbished tools and products second to none. GTS started as a service company repairing and providing preventive maintenance on Disco dicing saws and K&S dicing saws. Upon seeing what customers were purchasing...
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14
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MPE, Inc. is committed to outstanding customer service and your satisfaction is our #1 priority. We pride ourselves on our ability to complete all jobs in a timely and efficient manner. We process hundreds of wafers per month, with a normal lead time of three to five days. In most cases, we do have the ability to expedite wafers within one day, for those who need their material back...
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15
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Include a wide array of lines consisting of high-function adhesive tapes such as Non UV and UV dicing tape, BG surface protective tape, and die attach specialty films. Additionally, LINTEC is the industry leader in providing Wafer Mounting Systems and UV Irradiation Systems. Our products contribute to improve the workability of the quality in the back-grinding process and productivity in dicing...
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16
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0.0
We supply semiconductor wafer, custom dicing hybrid, substrate dicing and all types of dicing at customdicing.com. Get a dicing quotation. Accurate dicing services for customer materials up to 6" in diameter or square and rectangles as large as 6"x14". Materials processed are as diverse as Fused Silica, Silicon wafers, Glass, Sapphire and Quartz disks, Silicon Carbide, Ferrites, Ceramics, MEMS...
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17
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0.0
Arizona's semiconductor packaging, testing, and PCB fabrication specialists. Providing rapid prototyping, engineering, and production services. Advotech in Tempe, Arizona, offers a wide range of semiconductor packaging, testing, and PCB services. We provide clients with rapid prototyping, engineering services, and production planning. Talk to one of our experienced engineers to see how we can...
Rank
18
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