Sort
Thermocarbon’s continuous research and development on hubless blade compositions allows Thermocarbon to consistently produce high quality saw blades for cutting ceramics such as alumina oxide, alumina nitride, LTCC, HTCC; crystals such as sapphire, lithium niobate, lithium tantalate; other hard and brittle materials such as glass, fused silica, quartz, silicon wafers, garnet, copper, mold...
Rank
1
Vote
Sponsor
0.0
Using the highest quality materials, Dicing Blade Technology manufactures and sells a complete line of resinoid, nickel, and metal sintered dicing blades for a range of applications. Any size, thickness, and grit size. Dicing Blade Technology can custom manufacture a solution for you. Have an idea of what you need? Get the answers you need using our easy to use form.
Rank
2
Vote
Sponsor
0.0
Provides quick turn precision wafer dicing of hard brittle materials. Customers include telecommunications, biotech, medical, optical, the semiconductor industry, and many others. To see what we can do for you. Email or phone 408 254-1600. American Precision Dicing, Inc. - Quick turn wafer dicing.
Rank
3
Vote
Sponsor
0.0
PDP Micro Dicing Services provides dicing and sawing services to the microelectronic and optical industry. We specialize in hard to cut and brittle materials. PDP Micro Dicing Services has an in house production and research facility. Be sure to contact us for all of your dicing and sawing needs....
Rank
4
Vote
Sponsor
0.0
Dicing On The Cake - Games Cafe. Board Games, Card Games, Dice, Miniatures, TCG, CCG, LCG, Gaming Hobbyist. You can help us make this a reality! We have a wide range of games and accessories available to buy right now on-line and every purchase helps bring us closer to our goal. We stock all your...
Rank
5
Vote
Sponsor
0.0
Wafer dicing, optical and fiber optic materials dicing, MEMS dicing and hybrid and semiconductor circuits dicing as well as wafer backgrinding. Accurate dicing services for customer materials up to 6" in diameter or square and rectangles as large as 6"x14". Materials processed are as diverse as Fused Silica, Silicon wafers, Glass, Sapphire and Quartz disks, Silicon Carbide, Ferrites, Ceramics,...
Rank
6
Vote
Sponsor
0.0
The ingot is them sliced using a wire saw or an inside diameter saw to create a wafer that is uniform in thickness. The lapping and polishing processes are done to achieve the right thickness and to eliminate any imperfections that may be present in the rough wafer. The wafers can be single side or double side polished. The polished side of the wafer is the side that will be used to make the...
Rank
7
Vote
Sponsor
0.0
Production facility for semiconductor and microelectronics industry. Services include wafer dicing, die sorting, die bonding and wirebonding. Since 1987, American Dicing Inc. has been a high precision dicing and scribing operation for the microelectronic and miniature fabrication industries. We offer a broad range of services covering prototypes to production volumes and we can handle up to 12"...
Rank
8
Vote
Sponsor
0.0
ITI is a world leading manufacturer of superabrasive products focused on Precision Dicing Blades and Fine-Grinding (Flat-Honing) Plates. Our products are used globally on an infinite variety of applications including semiconductor packaging, glass, ceramics, crystals, composites, silicon carbide, hard disk drives, compound semiconductors, Chip-LED, HP LED (High Power LED), quartz, and also a...
Rank
9
Vote
Sponsor
0.0
Include a wide array of lines consisting of high-function adhesive tapes such as Non UV and UV dicing tape, BG surface protective tape, and die attach specialty films. Additionally, LINTEC is the industry leader in providing Wafer Mounting Systems and UV Irradiation Systems. Our products contribute to improve the workability of the quality in the back-grinding process and productivity in dicing...
Rank
10
Vote
Sponsor
0.0
Loadpoint develop and manufacture high precision dicing saws and machining systems for Semiconductors, MEMs, PZT and Piezo materials, Photonics and related industries. Loadpoint also supply dicing blades and dicing tapes and a range of other dicing consumables. Loadpoint works with their customers to help them overcome their dicing challenges so that they can develop new products and better...
Rank
11
Vote
Sponsor
0.0
Introduction: Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology has been one of the leading forces in development and patented applications of advanced materials and adhesive solutions for electronic interconnection and packaging. AI Technology now has one of the highest reliability adhesives and underfills for die bonding for the largest...
Rank
12
Vote
Sponsor
0.0
AE Advanced Engineering is a world leader in providing Dicing Environment equipment and materials to the semiconductor industry. Known for its reliable and robust products, AE develops innovative and marker-driven systems for use in the sophisticated and highly demanding microelectronics assembly market. Constantly working with its customers to help them meet ever-evolving process requirements,...
Rank
13
Vote
Sponsor
0.0
GTS started as a service company repairing and providing preventive maintenance on Disco dicing saws and K&S dicing saws. GTS now offers the industry the highest quality, best supported refurbished tools and products second to none. GTS started as a service company repairing and providing preventive maintenance on Disco dicing saws and K&S dicing saws. Upon seeing what customers were purchasing...
Rank
14
Vote
Sponsor
0.0
MPE, Inc. is committed to outstanding customer service and your satisfaction is our #1 priority. We pride ourselves on our ability to complete all jobs in a timely and efficient manner. We process hundreds of wafers per month, with a normal lead time of three to five days. In most cases, we do have the ability to expedite wafers within one day, for those who need their material back...
Rank
15
Vote
Sponsor
0.0
I was looking for a high quality scribing/breaking machine to cleave quantum cascade laser wafers into laser chips. I had a limited budget. The Dynatex team closely worked with me to fully understand the technical requirements for my laser fabrication processes. At the end, they offered me a refurbished system configuration within my budget that fully met my technical requirement. The system...
Rank
16
Vote
Sponsor
0.0
Syagrus Systems is a leading provider in post fab processes like wafer backgrinding & dicing, die inspection & sorting, & SMD Tape & Reel for many industries. Contact us today for more information! A variety of services are provided to meet your needs. All services are designed to be "consistently flexible", in that we can easily modify our processes and react quickly to your needs, while...
Rank
17
Vote
Sponsor
0.0
Advotech Company in Tempe, AZ is a semiconductor packaging microelectronics manufacturer specializing in dicing, wirebonding, X-ray & testing services. At Advotech Company, Inc., we offer a wide range of microelectronic semiconductor packaging, testing, and dicing services. From our facility in Tempe (Phoenix), Arizona We provide our clients with a quick turn process execution, and staff that...
Rank
18
Vote
Sponsor
0.0