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Thermocarbon’s continuous research and development on hubless blade compositions allows Thermocarbon to consistently produce high quality saw blades for cutting ceramics such as alumina oxide, alumina nitride, LTCC, HTCC; crystals such as sapphire, lithium niobate, lithium tantalate; other hard and brittle materials such as glass, fused silica, quartz, silicon wafers, garnet, copper, mold...
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Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website provides overall corporate information of DISCO such as the variety of products and technical information on the semiconductor manufacturing equipment, investor relations, and recruiting. Preliminary Report on Consolidated Sales Figures and Non-Consolidated Earnings...
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2
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GTS started as a service company repairing and providing preventive maintenance on Disco dicing saws and K&S dicing saws. GTS now offers the industry the highest quality, best supported refurbished tools and products second to none. GTS started as a service company repairing and providing...
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3
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Loadpoint develop and manufacture high precision dicing saws and machining systems for Semiconductors, MEMs, PZT and Piezo materials, Photonics and related industries. Loadpoint also supply dicing blades and dicing tapes and a range of other dicing consumables. Loadpoint works with their...
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4
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SlicingTech provides wire saw contract cutting, both slurry and diamond wire as well as ID and OD slicing. Our Wire Saws provide for slicing diameters up to 385 mm. Large table loading capabilities enable us to slice thousands of parts in as little as a three hour cycle time. This provides our...
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5
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ITI is a world leading manufacturer of superabrasive products focused on Precision Dicing Blades and Fine-Grinding (Flat-Honing) Plates. Our products are used globally on an infinite variety of applications including semiconductor packaging, glass, ceramics, crystals, composites, silicon carbide, hard disk drives, compound semiconductors, Chip-LED, HP LED (High Power LED), quartz, and also a...
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6
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Stone Valley Resources manufactures vacuum chucks for the semiconductor industry. Vacuum chucks are built for dicing saws, grinding and lapping equipment. We also rework worn or damaged chucks back to OEM specifications. Custom vacuum chucks are available. Dicing Chucks for Disco, K&S, ADT .... dicing saws. Chucks and plates for laser cutting systems, Chucks for Oakamoto, Accutec, Takatori.......
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7
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I was looking for a high quality scribing/breaking machine to cleave quantum cascade laser wafers into laser chips. I had a limited budget. The Dynatex team closely worked with me to fully understand the technical requirements for my laser fabrication processes. At the end, they offered me a refurbished system configuration within my budget that fully met my technical requirement. The system...
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8
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We provide quick turn precision laser dicing of various materials. Customers include telecommunications, biotech, medical, the semiconductor industry and many others. The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under...
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9
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We supply semiconductor wafer, custom dicing hybrid, substrate dicing and all types of dicing at customdicing.com. Get a dicing quotation. Accurate dicing services for customer materials up to 6" in diameter or square and rectangles as large as 6"x14". Materials processed are as diverse as Fused Silica, Silicon wafers, Glass, Sapphire and Quartz disks, Silicon Carbide, Ferrites, Ceramics, MEMS...
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10
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Northeast Semiconductor provides a range of services for back-end Semiconductor Processing Equipment. Our understanding of Dicing, Die Attach and Wire Bonding has been developed over decades of hands-on experience. At Northeast Semiconductor, our capabilities are flexible, allowing you to receive services tailored to your specific requirements. This helps you to ensure your equipment and your...
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11
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MPE, Inc. is committed to outstanding customer service and your satisfaction is our #1 priority. We pride ourselves on our ability to complete all jobs in a timely and efficient manner. We process hundreds of wafers per month, with a normal lead time of three to five days. In most cases, we do have the ability to expedite wafers within one day, for those who need their material back...
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12
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GDSI , Grinding and Dicing Services complete resource for Silicon Wafers Processing includes Probing, Bumping, Grinding, Polishing in San Jose, California. Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the desired results for your specific project, GDSI continuously researches emerging applications...
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13
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Production facility for semiconductor and microelectronics industry. Services include wafer dicing, die sorting, die bonding and wirebonding. Since 1987, American Dicing Inc. has been a high precision dicing and scribing operation for the microelectronic and miniature fabrication industries. We offer a broad range of services covering prototypes to production volumes and we can handle up to 12"...
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14
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Using the highest quality materials, Dicing Blade Technology manufactures and sells a complete line of resinoid, nickel, and metal sintered dicing blades for a range of applications. Any size, thickness, and grit size. Dicing Blade Technology can custom manufacture a solution for you. Have an idea of what you need? Get the answers you need using our easy to use form.
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15
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The ingot is them sliced using a wire saw or an inside diameter saw to create a wafer that is uniform in thickness. The lapping and polishing processes are done to achieve the right thickness and to eliminate any imperfections that may be present in the rough wafer. The wafers can be single side or double side polished. The polished side of the wafer is the side that will be used to make the...
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16
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PDP Micro Dicing Services provides dicing and sawing services to the microelectronic and optical industry. We specialize in hard to cut and brittle materials. PDP Micro Dicing Services has an in house production and research facility. Be sure to contact us for all of your dicing and sawing needs. Micro Dicing Services provides Sawing Services to the microelectronic and the optical industry. Our...
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17
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