Wafer Dicing Sites

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AE Advanced Engineering is a world leader in providing Dicing Environment equipment and materials to the semiconductor industry. Known for its reliable and robust products, AE develops innovative and marker-driven systems for use in the sophisticated and highly demanding microelectronics assembly market. Constantly working with its customers to help them meet ever-evolving process requirements,...
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Provides quick turn precision wafer dicing of hard brittle materials. Customers include telecommunications, biotech, medical, optical, the semiconductor industry, and many others. To see what we can do for you. Email or phone 408 254-1600. American Precision Dicing, Inc. - Quick turn wafer dicing.
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Syagrus Systems is a leading provider in post fab processes like wafer backgrinding & dicing, die inspection & sorting, & SMD Tape & Reel for many industries. Contact us today for more information! A variety of services are provided to meet your needs. All services are designed to be...
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I was looking for a high quality scribing/breaking machine to cleave quantum cascade laser wafers into laser chips. I had a limited budget. The Dynatex team closely worked with me to fully understand the technical requirements for my laser fabrication processes. At the end, they offered me a...
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Production facility for semiconductor and microelectronics industry. Services include wafer dicing, die sorting, die bonding and wirebonding. Since 1987, American Dicing Inc. has been a high precision dicing and scribing operation for the microelectronic and miniature fabrication industries. We...
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Top Wafer Dicing Sites (20)
Production facility for semiconductor and microelectronics industry. Services include wafer dicing, die sorting, die bonding and wirebonding. Since 1987, American Dicing Inc. has been a high precision dicing and scribing operation for the microelectronic and miniature fabrication industries. We offer a broad range of services covering prototypes to production volumes and we can handle up to 12"...
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We provide quick turn precision laser dicing of various materials. Customers include telecommunications, biotech, medical, the semiconductor industry and many others. The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under...
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Wafer dicing, optical and fiber optic materials dicing, MEMS dicing and hybrid and semiconductor circuits dicing as well as wafer backgrinding. Accurate dicing services for customer materials up to 6" in diameter or square and rectangles as large as 6"x14". Materials processed are as diverse as Fused Silica, Silicon wafers, Glass, Sapphire and Quartz disks, Silicon Carbide, Ferrites, Ceramics,...
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No matter what kind of project you have-no matter how big or how small, how simple or complex, how many or how few - if it's made out of metal or plastic, you should talk to Engineering R & D Consultant Corp. Our customer service is legendary and our quality is unmatched. Call us today and experience the Engineering R & D Consultant Corp. style of business. Thermocouple Wafer, Heater, Diamond...
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We are a team of an experienced energetic entrepreneurs that started INTECH back in year 2008. We embark in our semiconductors adventure believing in innovation, integration and interdependent-focused solutions in post fabrication and semiconductors packaging services. Focusing on our customers’ requirements and the significance of time-to-market, we want to help our customers stay competitive...
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Wafer Reclaim and processing services including wafer grinding and thinning, wafer edge trimming, wafer dicing, wafer resizing, wafer polishing and wafer bonding from Rockwood Wafer Reclaim. We have been providing wafer processing services offering a local, high quality, reliable, value for money service to our customers for over thirty years. As well as providing unrivalled technical support....
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MPE, Inc. is committed to outstanding customer service and your satisfaction is our #1 priority. We pride ourselves on our ability to complete all jobs in a timely and efficient manner. We process hundreds of wafers per month, with a normal lead time of three to five days. In most cases, we do have the ability to expedite wafers within one day, for those who need their material back...
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MPE, Inc. is committed to outstanding customer service and your satisfaction is our #1 priority. We pride ourselves on our ability to complete all jobs in a timely and efficient manner. We process hundreds of wafers per month, with a normal lead time of three to five days. In most cases, we do have the ability to expedite wafers within one day, for those who need their material back...
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Semiconductor processing services from University Wafer. Fast turnaound. Call us today for all your semiconductor processing needs. Lithium Niobate LiNbO3 * Soda Lime * D263 * Wafer Dicing * Indium Tin Oxide * Float Zone * Super-Thin & Flat Wafer Silicon 25um, 50um, 75um, 100um For MEMS. Please describe your semiconductor wafer needs below. We respond within ten minutes. Gallium Nitride Gallium...
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Fused Silica wafers as thin as 100um and all diameters and dimensions in stock. Lithium Niobate LiNbO3 * Soda Lime * D263 * Wafer Dicing * Indium Tin Oxide * Float Zone * Super-Thin & Flat Wafer Silicon 25um, 50um, 75um, 100um For MEMS. Please fill out the form below for our Fused Glass Wafers. Let us know what specs and quantity that you need. Gallium Nitride Gallium Arsenide Sapphire Glass...
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Semiconductor processing services from University Wafer. Fast turnaound. Call us today for all your semiconductor processing needs. Lithium Niobate LiNbO3 * Soda Lime * D263 * Wafer Dicing * Indium Tin Oxide * Float Zone * Super-Thin & Flat Wafer Silicon 25um, 50um, 75um, 100um For MEMS. Please describe your semiconductor processing needs below. We respond within ten minutes. Gallium Nitride...
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Semiconductor processing services from University Wafer. Fast turnaound. Call us today for all your semiconductor processing needs. Lithium Niobate LiNbO3 * Soda Lime * D263 * Wafer Dicing * Indium Tin Oxide * Float Zone * Super-Thin & Flat Wafer Silicon 25um, 50um, 75um, 100um For MEMS. Please describe your semiconductor processing needs below. We respond within ten minutes. Gallium Nitride...
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Semiconductor processing services from University Wafer. Fast turnaound. Call us today for all your semiconductor processing needs. Lithium Niobate LiNbO3 * Soda Lime * D263 * Wafer Dicing * Indium Tin Oxide * Float Zone * Super-Thin & Flat Wafer Silicon 25um, 50um, 75um, 100um For MEMS. Please describe your semiconductor processing needs below. We respond within ten minutes. Gallium Nitride...
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Kulicke & Soffa Launches FCCTM Hub Blades - A Customizable Wafer Dicing Solution for Advanced Packaging. Kulicke & Soffa Introduces Comprehensive Solution For Fine Aluminum (Wedge-to- Wedge) Wire Bonding. This web site is best viewed in 1280 x 800 resolution.
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Blades Overnight was created to provide a source of premium dicing blades that can be shipped from inventory and delivered overnight. To serve you better, we've updated our online store. If you are a current customer you will need to reset your login password to access your account profile. See instructions here. Please don't hesitate to contact us at 1(877)848-3032 or...
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