Wafer Bumping Sites

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TLMI Corp is a Full Service Wafer Bumping and Pad Redistribution company. Offering a wide range of copper, indium , gold, and solder bumping services. When you are looking for Quality and dependability, rely on TLMI as your full-service wafer bumping partner. TLMI, strategically located in Austin, TX, is dedicated to delivering the highest customer satisfaction and most advanced technology in...
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FlipChip International is a world leading WLCSP bumping supplier, with wafer dicing and thinning capabilities, ASIC, ASPP and ASSP design, and a complete IC service from design to packaging. FlipChip International, LLC (FCI) is the world’s premier technology and merchant supplier of advanced...
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Amkor Technology is the world's leading supplier of outsourced semiconductor interconnect services. With over 35 years of continuous improvement, growth and innovation, Amkor has become a trusted partner for most of the world’s leading semiconductor suppliers. Demand for flip chip interconnect...
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Designed and developed by Codify Design Studio - codifydesign.com. Wafer bumping is a fast-growing method of packaging silicon for high-density and high-frequency applications. The bumping process is constantly being improved and cost is decreasing, making these interconnect methods more popular....
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Top Wafer Bumping Sites (10)
Founded in 1971, IMI is a provider of wafer bumping and wafer level processing (WLP) contract services to EMS customers and end-users in the advanced packaging, MEMS and advanced sensor markets. IMI provides scalable wafer bumping and wafer level processing services from prototyping of new designs through high-volume sustained production and turn-key technology licensing agreements for our...
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I2a Technologies provides wafer packaging services. From dicing and wirebonding, to wafer level packaging ie, ubm, bumping flip chip, bga, etc. I2a Technologies makes no guarantee or warranty of its accuracy, or that the use of such information will not infringe upon the IP rights of third parties. i2a shall not be responsible for any loss or damage of whatever nature, resulting from the use of...
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The official website of PacTech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services. PacTech is a leading supplier of Advanced Packaging Equipment with more than eighteen years of engineering experience. Our state-of-the-art automated equipment meets high quality standards and is suitable for various applications. Read more. PacTech...
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How to pick a lock and make homemade lock picks, pin tumbler lock pick techniques, wafer locks, tubular locks and cars. Provides legality of burglary tools in US, pick templates, bump keys. Welcome to the lock pick guide, where you will learn how to pick a lock! This site is dedicated to the art of picking locks and of making picks for the amateur lock picker. It contains information on how to...
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GDSI , Grinding and Dicing Services complete resource for Silicon Wafers Processing includes Probing, Bumping, Grinding, Polishing in San Jose, California. Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the desired results for your specific project, GDSI continuously researches emerging applications...
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