Laser Dicing Sites

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We provide quick turn precision laser dicing of various materials. Customers include telecommunications, biotech, medical, the semiconductor industry and many others. The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under...
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Customers can call on DISCO’s precision tools and precision equipment by using the chargeable processing service DGS (Dicing-Grinding Service). DISCO EUROPE is proud to introduce its new laser laboratory. The lab features 4 short pulse lasers, 1 research-grade dicing machine, and a set-up for optical experiments and measurements. DISCO application engineers are working closely with customers...
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I was looking for a high quality scribing/breaking machine to cleave quantum cascade laser wafers into laser chips. I had a limited budget. The Dynatex team closely worked with me to fully understand the technical requirements for my laser fabrication processes. At the end, they offered me a...
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For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical. See what it's like to be an ESI customer...
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Go from idea to manufacturing in a few days or weeks! MicroConnex specializes in custom design and mid-volume manufacturing of high-density flex circuits. 1 mil trace and space & microvias on a wide range of material combinations tell only half the story with our flexible circuits. A team...
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Top Laser Dicing Sites (17)
CNC fused silica machining into intricate shapes with micron tolerances and Angstrom level surface finishes as large as 450mm and as thin as 25 microns. Valley Design provides Fused Silica CNC machining, grinding, flat lapping, polishing, dicing, annealing, etching, drilling, chamfering, bead blasting, sand blasting, laser slag removal, ultrasonic rotary drilling, and Blanchard grinding. These...
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Stone Valley Resources manufactures vacuum chucks for the semiconductor industry. Vacuum chucks are built for dicing saws, grinding and lapping equipment. We also rework worn or damaged chucks back to OEM specifications. Custom vacuum chucks are available. Dicing Chucks for Disco, K&S, ADT .... dicing saws. Chucks and plates for laser cutting systems, Chucks for Oakamoto, Accutec, Takatori.......
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Polished silicon wafers from a custom polishing house which can supply the thinnest and the tightest tolerance wafers including sapphire, glass and quartz. 100mm FZ polished optical grade Silicon available from stock. We offer a complete line of polished Fused Silica, 99.6% Alumina, Aluminum Nitride, and Sapphire wafers and substrates. Polished Silicon wafers of any size and thickness for...
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Pelican Packaging is recognized as a leading providers of full service automated semiconductor packaging. We provide a one stop service for all your packaging needs. Our services include but are not limited to: Tape and Reel, Laser Marking, Wafer Dicing, Electrical Test, Bowl Feeders, Odd Shapes, etc. Pelican Packaging uses state of the art automated packaging machines and equipment powered by...
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