Dicing Sites

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GTS started as a service company repairing and providing preventive maintenance on Disco dicing saws and K&S dicing saws. GTS now offers the industry the highest quality, best supported refurbished tools and products second to none. GTS started as a service company repairing and providing preventive maintenance on Disco dicing saws and K&S dicing saws. Upon seeing what customers were purchasing...
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Loadpoint develop and manufacture high precision dicing saws and machining systems for Semiconductors, MEMs, PZT and Piezo materials, Photonics and related industries. Loadpoint also supply dicing blades and dicing tapes and a range of other dicing consumables. Loadpoint works with their customers to help them overcome their dicing challenges so that they can develop new products and better...
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Loadpoint develop and manufacture high precision dicing saws and machining systems for Semiconductors, MEMs, PZT and Piezo materials, Photonics and related industries. Loadpoint also supply dicing blades and dicing tapes and a range of other dicing consumables. Loadpoint works with their...
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Production facility for semiconductor and microelectronics industry. Services include wafer dicing, die sorting, die bonding and wirebonding. Since 1987, American Dicing Inc. has been a high precision dicing and scribing operation for the microelectronic and miniature fabrication industries. We...
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Stone Valley Resources manufactures vacuum chucks for the semiconductor industry. Vacuum chucks are built for dicing saws, grinding and lapping equipment. We also rework worn or damaged chucks back to OEM specifications. Custom vacuum chucks are available. Dicing Chucks for Disco, K&S, ADT .......
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Top Dicing Sites (18)Top Dicing Saws Sites (18)Top Laser Dicing Sites (17)Top Wafer Dicing Sites (20)
Top Dicing Blades Sites (16)
We provide quick turn precision laser dicing of various materials. Customers include telecommunications, biotech, medical, the semiconductor industry and many others. The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under...
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Wafer dicing, optical and fiber optic materials dicing, MEMS dicing and hybrid and semiconductor circuits dicing as well as wafer backgrinding. Accurate dicing services for customer materials up to 6" in diameter or square and rectangles as large as 6"x14". Materials processed are as diverse as Fused Silica, Silicon wafers, Glass, Sapphire and Quartz disks, Silicon Carbide, Ferrites, Ceramics,...
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High volume production dicing of wafers and substrates with quick turnaround utilizing precision dicing equipment from DISCO and K & S, from R & D prototypes to full production. Utilizing programmable DISCO and K&S saws, parts can be diced to micron level tolerances with 200X optical magnification. Valley has recently expanded its dicing department, and now offers one of the largest production...
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Provides quick turn precision wafer dicing of hard brittle materials. Customers include telecommunications, biotech, medical, optical, the semiconductor industry, and many others. To see what we can do for you. Email or phone 408 254-1600. American Precision Dicing, Inc. - Quick turn wafer dicing.
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Production facility for semiconductor and microelectronics industry. Services include wafer dicing, die sorting, die bonding and wirebonding. Since 1987, American Dicing Inc. has been a high precision dicing and scribing operation for the microelectronic and miniature fabrication industries. We offer a broad range of services covering prototypes to production volumes and we can handle up to 12"...
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Thermocarbon’s continuous research and development on hubless blade compositions allows Thermocarbon to consistently produce high quality saw blades for cutting ceramics such as alumina oxide, alumina nitride, LTCC, HTCC; crystals such as sapphire, lithium niobate, lithium tantalate; other hard and brittle materials such as glass, fused silica, quartz, silicon wafers, garnet, copper, mold...
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AE Advanced Engineering is a world leader in providing Dicing Environment equipment and materials to the semiconductor industry. Known for its reliable and robust products, AE develops innovative and marker-driven systems for use in the sophisticated and highly demanding microelectronics assembly market. Constantly working with its customers to help them meet ever-evolving process requirements,...
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PDP Micro Dicing Services provides dicing and sawing services to the microelectronic and optical industry. We specialize in hard to cut and brittle materials. PDP Micro Dicing Services has an in house production and research facility. Be sure to contact us for all of your dicing and sawing needs. Micro Dicing Services provides Sawing Services to the microelectronic and the optical industry. Our...
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The ingot is them sliced using a wire saw or an inside diameter saw to create a wafer that is uniform in thickness. The lapping and polishing processes are done to achieve the right thickness and to eliminate any imperfections that may be present in the rough wafer. The wafers can be single side or double side polished. The polished side of the wafer is the side that will be used to make the...
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Customers can call on DISCO’s precision tools and precision equipment by using the chargeable processing service DGS (Dicing-Grinding Service). DISCO EUROPE is proud to introduce its new laser laboratory. The lab features 4 short pulse lasers, 1 research-grade dicing machine, and a set-up for optical experiments and measurements. DISCO application engineers are working closely with customers...
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Using the highest quality materials, Dicing Blade Technology manufactures and sells a complete line of resinoid, nickel, and metal sintered dicing blades for a range of applications. Any size, thickness, and grit size. Dicing Blade Technology can custom manufacture a solution for you. Have an idea of what you need? Get the answers you need using our easy to use form.
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Semiconductor Systems sells and provides technical support for used dicing saws and other equipment in the semiconductor industry. Semiconductor Systems Inc. strives to provide the highest quality refurbished equipment used in the semiconductor and associated industries. Our organizations goal is to provide your company with upmost quality service and support. We recognize each customer’s...
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I was looking for a high quality scribing/breaking machine to cleave quantum cascade laser wafers into laser chips. I had a limited budget. The Dynatex team closely worked with me to fully understand the technical requirements for my laser fabrication processes. At the end, they offered me a refurbished system configuration within my budget that fully met my technical requirement. The system...
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CNC fused silica machining into intricate shapes with micron tolerances and Angstrom level surface finishes as large as 450mm and as thin as 25 microns. Valley Design provides Fused Silica CNC machining, grinding, flat lapping, polishing, dicing, annealing, etching, drilling, chamfering, bead blasting, sand blasting, laser slag removal, ultrasonic rotary drilling, and Blanchard grinding. These...
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Polishing, lapping, back-lapping, dicing, backgrinding are some of the capabilities of the world's leading company supplying optical polishing services. Valley Design is an ISO 9001:2015 certified manufacturer, and is committed to customer satisfaction and to continually improving our products, services and the internal procedures which make our business run. For over 37 years, Valley Design...
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